Display device

ABSTRACT

A display device including a light source; a wavelength conversion member to convert a wavelength of light generated from the light source; a light guide member to guide the light converted by the wavelength conversion member; and an adhering member. In addition, the wavelength conversion member includes a first surface facing the light source; a second surface facing the light guide member; a top surface extending from the first surface to the second surface; and a bottom surface facing the top surface. Furthermore, the adhering member is disposed on the top surface and the bottom surface. Also, the wavelength conversion member includes a tube, the tube receives a sealing member, an air layer and a matrix therein, and the air layer is formed between the sealing member and the matrix.

This application is a continuation of co-pending U.S. patent applicationSer. No. 14/885,743 filed on Oct. 16, 2015, which is a continuation ofU.S. patent application Ser. No. 14/006,912 filed on Oct. 17, 2013 (nowU.S. Pat. No. 9,201,189 issued on Dec. 1, 2015), which is the nationalphase of PCT International Application No. PCT/KR2012/002024 filed onMar. 21, 2012, which claims the benefit of Korean patent application No.10-2011-0025531 filed on Mar. 22, 2011, the entire contents of all ofthe above applications are hereby incorporated by reference.

TECHNICAL FIELD

The embodiment relates to a display device.

BACKGROUND ART

Recently, flat display devices, such as an LCD (liquid crystal display),a PDA (plasma display panel) or an OLED (organic light emitting diode),have been increasingly developed instead of conventional CRTs (cathoderay tubes).

Among them, the LCD includes a liquid crystal display panel having athin film transistor substrate, a color filter substrate and a liquidcrystal injected between the thin film transistor substrate and thecolor filter substrate. Since the liquid crystal display panel is anon-emissive device, a backlight unit is provided below the thin filmtransistor substrate to supply light. Transmittance of the light emittedfrom the backlight unit is adjusted according to the alignment state ofthe liquid crystal.

The backlight unit is classified into an edge-illumination typebacklight unit and a direct-illumination type backlight unit accordingto the position of a light source. According to the edge-illuminationtype backlight unit, the light source is located at a lateral side of alight guide plate.

The direct-illumination type backlight unit has been developed as thesize of the LCD has become enlarged. According to thedirect-illumination type backlight unit, at least one light source islocated below the liquid crystal display panel to supply the light overthe whole area of the liquid crystal display panel.

When comparing with the edge-illumination type backlight unit, thedirect-illumination type backlight unit can employ a large number oflight sources so that the high brightness can be achieved. In contrast,the direct-illumination type backlight unit must have thickness largerthan thickness of the edge-illumination type backlight unit in order toensure brightness uniformity.

In order to solve the above problem, a quantum dot bar having aplurality of quantum dots, which can convert blue light into red lightor green light, is positioned in front of a blue LED that emits the bluelight. Thus, as the blue light is irradiated onto the quantum dot bar,the blue light, the red light and the green light are mixed and themixed light is incident into the light guide plate, thereby generatingwhite light.

If the white light is supplied to the light guide plate by using thequantum dot bar, high color reproduction may be realized.

The backlight unit may include an FPCB (flexible printed circuit board)provided at one side of the blue LED to supply signals and power to theLEDs and a bonding member formed under the bottom surface of the FPCB.

The display device, which is capable of displaying various images usingthe white light supplied to the light guide plate through the quantumdot bar as the blue light is emitted from the blue LED, has beenextensively used.

DISCLOSURE Technical Problem

The embodiment provides a display device, which can be readilymanufactured and has improved reliability.

Technical Solution

A display device according to one embodiment includes a light source; awavelength conversion member to convert a wavelength of light generatedfrom the light source; and a light guide member to guide the lightconverted by the wavelength conversion member, wherein the wavelengthconversion member is disposed in an insertion hole formed in the lightguide member.

A display device according to one embodiment includes a light source; awavelength conversion member to convert a wavelength of light generatedfrom the light source; a light guide section to guide the lightconverted by the wavelength conversion member; a rear support sectionconnected to the light guide section; and a display panel disposed onthe light guide section, wherein the wavelength conversion member issandwiched between the light guide section and the rear support section.

A display device according to one embodiment includes a light guidemember formed with a first insertion hole and a second insertion holeadjacent to the first insertion hole; a display panel disposed on thelight guide member; a wavelength conversion member aligned in the firstinsertion hole; and a light source aligned in the second insertion hole.

Advantageous Effects

According to the display device of the embodiment, the light source andthe wavelength conversion member are disposed in the insertion hole ofthe light guide member. That is, according to the display device of theembodiment, the light source and the wavelength conversion member can beinserted into the insertion hole. Thus, the light source and thewavelength conversion member can be coupled with the light guide memberwithout performing the bonding process.

Therefore, the light source, the wavelength conversion member and thelight guide member can be coupled with each other through a simpleassembling process. Thus, the display device according to the embodimentcan be readily manufactured.

In addition, the light source is inserted into the insertion hole of thelight guide member so that the light source can be securely fixed to thelight guide member. Thus, the light source can be prevented from beingseparated from the light guide member. That is, the light generated fromthe light source is effectively incident into the wavelength conversionmember, and the light converted by the wavelength conversion member canbe effectively incident into the light guide member. Thus, the displaydevice according to the embodiment may have the improved reliability.

DESCRIPTION OF DRAWINGS

FIG. 1 is an exploded perspective view showing an LCD according to thefirst embodiment;

FIG. 2 is a sectional view taken along line A-A′ of FIG. 1;

FIG. 3 is a perspective view of a wavelength conversion member accordingto the first embodiment;

FIG. 4 is a sectional view taken along line B-B′ of FIG. 3;

FIGS. 5 and 6 are views showing a light emitting diode and a wavelengthconversion member being inserted into a light guide plate;

FIG. 7 is a sectional view showing an LCD according to the secondembodiment;

FIG. 8 is a perspective view of a wavelength conversion member accordingto the second embodiment;

FIG. 9 is a sectional view of a LCD according to the second embodiment;

FIGS. 10 and 11 are sectional views showing the manufacturing processfor an LCD according to the third embodiment;

FIG. 12 is a perspective view showing a light source, a light guideplate and a wavelength conversion member according to the fourthembodiment;

FIG. 13 is a sectional view showing a light source, a light guide plateand a wavelength conversion member according to the fourth embodiment;

FIG. 14 is a sectional view showing a light source, a light guide plateand a wavelength conversion member according to the fifth embodiment;

FIG. 15 is a sectional view of an LCD according to the sixth embodiment;

FIG. 16 is a perspective view showing a light source, a light guideplate and a wavelength conversion member according to the seventhembodiment; and

FIG. 17 is a sectional view showing a light source, a light guide plateand a wavelength conversion member according to the seventh embodiment.

BEST MODE Mode for Invention

In the description of the embodiments, it will be understood that when asubstrate, a frame, a sheet, a layer or a pattern is referred to asbeing “on” or “under” another substrate, another frame, another sheet,another layer, or another pattern, it can be “directly” or “indirectly”on the other substrate, frame, sheet, layer, or pattern, or one or moreintervening layers may also be present. Such a position has beendescribed with reference to the drawings. The thickness and size of eachlayer shown in the drawings may be exaggerated, omitted or schematicallydrawn for the purpose of convenience or clarity. In addition, the sizeof elements does not utterly reflect an actual size.

FIG. 1 is an exploded perspective view showing an LCD according to thefirst embodiment, FIG. 2 is a sectional view taken along line A-A′ ofFIG. 1, FIG. 3 is a perspective view of a wavelength conversion memberaccording to the first embodiment, FIG. 4 is a sectional view takenalong line B-B′ of FIG. 3, and FIGS. 5 and 6 are views showing a lightemitting diode and a wavelength conversion member being inserted into alight guide plate.

Referring to FIGS. 1 to 6, the LCD according to the embodiment includesa mold frame 10, a backlight unit 20 and a liquid crystal panel 30.

The mold frame 10 receives the backlight assembly 20 and the liquidcrystal panel 30 therein. The mold frame 10 has a rectangular frameshape and may include plastic or reinforced plastic.

In addition, a chassis may be disposed below the mold frame 10. Thechassis surrounds the mold frame 10 and supports the backlight assembly20. The chassis may also be disposed at a lateral side of the mold frame10.

The backlight assembly 20 is disposed in the mold frame 10 to supply thelight toward the liquid crystal panel 30. The backlight assembly 20includes a reflective sheet 100, a light guide plate 200, a lightsource, such as light emitting diodes 300, a wavelength conversionmember 400, a plurality of optical sheets 500, and a flexible printedcircuit board (FPCB) 600.

The reflective sheet 100 reflects the light upward as the light isgenerated from the light emitting diodes 300.

The light guide plate 200 is disposed on the reflective sheet 100. Thelight guide plate 200 guides the light upward by reflecting, refractingand scattering the light incident thereto from the light emitting diodes300. The light guide plate 200 is a light guide member for guiding thelight emitted from the light emitting diodes 300.

An insertion hole 201 is formed in the light guide plate 200. Theinsertion hole 201 may be formed through the light guide plate 200. Thelight emitting diodes 300 and the wavelength conversion member 400 areinserted into the insertion hole 201. That is, the light emitting diodes300 and the wavelength conversion member 400 are disposed in theinsertion hole 201.

As shown in FIGS. 1, 2, 5 and 6, the light guide plate 200 includes alight guide section 210 and a rear support section 220.

The light guide section 210 receives the light emitted from the lightemitting diodes 300 and guides the light upward by reflecting,refracting and scattering the light. The light guide section includes anincident surface 211 facing the light emitting diodes 300. That is, theincident surface 211 is one of inner surfaces of the insertion hole 201.

The rear support section 220 is connected to the light guide section210. In detail, the rear support section 220 may be integrally formedwith the light guide section 210. If the rear support section 220 isintegrally formed with the light guide section 210, strength of thelight guide plate 200 can be improved. In addition, the rear supportsection 220 can be integrally formed with the light guide section 210 byperforming the injection molding process one time.

The rear support section 220 supports the light emitting diodes 300. Therear support section 220 may directly make contact with the lightemitting diodes 300. The rear support section 220 may support a rearsurface of the light emitting diodes 300, which is opposite to an exitsurface of the light emitting diodes 300.

The light emitting diodes 300 and the wavelength conversion member 400are sandwiched between the rear support section 220 and the light guidesection 210. In detail, the rear support section 220 and the light guidesection face each other while interposing the light emitting diodes 300and the wavelength conversion member 400 therebetween. In addition, therear support section 220 and the light guide section 210 may surroundthe light emitting diodes 300 and the wavelength conversion member 400.

Further, the light emitting diodes 300 and the wavelength conversionmember 400 may be press-fitted into the insertion hole 201. Thus, therear support section 220 and the light guide section 210 may applypredetermined pressure to the light emitting diodes 300 and thewavelength conversion member 400 so that the light emitting diodes 300and the wavelength conversion member 400 can be fixed.

The light emitting diodes 300 are disposed in the insertion hole 201. Indetail, the light emitting diodes 300 are inserted into the insertionhole 201.

The light emitting diodes 300 serve as a light source for generating thelight. In detail, the light emitting diodes 300 emit the light towardthe wavelength conversion member 400.

The light emitting diodes 300 may include a blue light emitting diodegenerating the blue light or a UV light emitting diode generating the UVlight. In detail, the light emitting diodes 300 can emit the blue lighthaving the wavelength band of about 430 nm to about 470 nm or the UVlight having the wavelength band of about 300 nm to about 400 nm.

The light emitting diodes 300 are mounted on the FPCB 600. The lightemitting diodes 300 can be disposed under the FPCB 600. The lightemitting diodes 300 are driven by receiving a driving signal through theFPCB 600.

The wavelength conversion member 400 is disposed in the insertion hole201. In detail, the wavelength conversion member 400 is disposedadjacent to the incident surface 211 of the light guide section 210. Thewavelength conversion member 400 is interposed between the lightemitting diodes 300 and the light guide section 210.

The wavelength conversion member 400 may directly make contact with theincident surface 211 of the light guide section 210. In addition, thewavelength conversion member 400 may directly make contact with the exitsurface of the light emitting diodes 300.

The wavelength conversion member 400 receives the light from the lightemitting diodes 300 to convert the wavelength of the light. Forinstance, the wavelength conversion member 400 can convert the bluelight emitted from the light emitting diodes 300 into the green lightand the red light. In detail, the wavelength conversion member 400converts a part of the blue light into the green light having thewavelength in the range of about 520 nm to about 560 nm, and a part ofthe blue light into the red light having the wavelength in the range ofabout 630 nm to about 660 nm.

In addition, the wavelength conversion member 400 can convert the UVlight emitted from the light emitting diodes 300 into the blue light,the green light and the red light. In detail, the wavelength conversionmember 400 converts a part of the UV light into the blue light havingthe wavelength in the range of about 430 nm to about 470 nm, a part ofthe UV light into the green light having the wavelength in the range ofabout 520 nm to about 560 nm, and a part of the UV light into the redlight having the wavelength in the range of about 630 nm to about 660nm.

Therefore, the white light may be generated by the light passing throughthe wavelength conversion member 400 and the lights converted by thewavelength conversion member 400. In detail, the blue light, the greenlight and the red right are combined with each other so that the whitelight can be incident into the light guide plate 200.

As shown in FIGS. 2 to 4, the wavelength conversion member 400 includesa tube 410, a sealing member 420, a plurality of wavelength conversionparticles 430, and a matrix 440.

The tube 410 receives the sealing member 420, the wavelength conversionparticles 430 and the matrix 440 therein. That is, the tube 410 mayserve as a receptacle to receive the sealing member 420, the wavelengthconversion particles 430 and the matrix 440. In addition, the tube 410extends in one direction.

The tube 410 may have a rectangular tubular shape. In detail, a sectionof the tube 410, which is vertical to the length direction of the tube410, may have the rectangular shape. The tube 410 may have a width ofabout 0.6 mm and a height of about 0.2 mm. The tube 410 may include acapillary tube.

The tube 410 is transparent. The tube 410 may include glass. In detail,the tube 410 may include a glass capillary tube.

The sealing member 420 is disposed in the tube 410. The sealing member420 is arranged at an end of the tube 410 to seal the tube 410. Thesealing member 420 may include epoxy resin.

The wavelength conversion particles 430 are provided in the tube 410. Indetail, the wavelength conversion particles 430 are uniformlydistributed in the matrix 440 installed in the tube 410.

The wavelength conversion particles 430 convert the wavelength of thelight emitted from the light emitting diodes 300. In detail, the lightis incident into the wavelength conversion particles 430 from the lightemitting diodes 300 and the wavelength conversion particles 430 convertthe wavelength of the incident light. For instance, the wavelengthconversion particles 430 can convert the blue light emitted from thelight emitting diodes 300 into the green light and the red light. Thatis, a part of the wavelength conversion particles 430 converts the bluelight into the green light having the wavelength in the range of about520 nm to about 560 nm and a part of the wavelength conversion particles430 converts the blue light into the red light having the wavelength inthe range of about 630 nm to about 660 nm.

In addition, the wavelength conversion particles 430 can convert the UVlight emitted from the light emitting diodes 300 into the blue light,the green light and the red light. That is, a part of the wavelengthconversion particles 430 converts the UV light into the blue lighthaving the wavelength in the range of about 430 nm to about 470 nm, anda part of the wavelength conversion particles 430 converts the UV lightinto the green light having the wavelength in the range of about 520 nmto about 560 nm. Further, a part of the wavelength conversion particles430 converts the UV light into the red light having the wavelength inthe range of about 630 nm to about 660 nm.

In other words, if the light emitting diodes 300 are blue light emittingdiodes that emit the blue light, the wavelength conversion particles 430capable of converting the blue light into the green light and the redlight may be employed. In addition, if the light emitting diodes 300 areUV light emitting diodes that emit the UV light, the wavelengthconversion particles 430 capable of converting the UV light into theblue light, the green light and the red light may be employed.

The wavelength conversion particles 430 may include a plurality ofquantum dots. The quantum dots may include core nano-crystals and shellnano-crystals surrounding the core nano-crystals. In addition, thequantum dots may include organic ligands bonded to the shellnano-crystals. Further, the quantum dots may include an organic coatinglayer surrounding the shell nano-crystals.

The shell nano-crystals can be prepared as at least two layers. Theshell nano-crystals are formed on the surface of the core nano-crystals.The quantum dots lengthen the wavelength of the light incident into thecore nano-crystals by using the shell nano-crystals forming a shelllayer, thereby improving the light efficiency.

The quantum dots may include at least one of a group-II compoundsemiconductor, a group-III compound semiconductor, a group-V compoundsemiconductor, and a group-VI compound semiconductor. In more detail,the core nano-crystals may include CdSe, InGaP, CdTe, CdS, ZnSe, ZnTe,ZnS, HgTe or HgS. In addition, the shell nano-crystals may includeCuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The quantum dotmay have a diameter of about 1 nm to about 10 nm.

The wavelength of the light emitted from the quantum dots can beadjusted according to the size of the quantum dot or the molar ratiobetween the molecular cluster compound and the nano-particle precursorin the synthesis process. The organic ligand may include pyridine,mercapto alcohol, thiol, phosphine and phosphine oxide. The organicligand may stabilize the unstable quantum dots after the synthesisprocess. Dangling bonds may be formed at the valence band and thequantum dots may be unstable due to the dangling bonds. However, sinceone end of the organic ligand is the non-bonding state, one end of theorganic ligand is bonded with the dangling bonds, thereby stabilizingthe quantum dots.

In particular, if the size of the quantum dot is smaller than the Bohrradius of an exciton, which consists of an electron and a hole excitedby light and electricity, the quantum confinement effect may occur, sothat the quantum dot may have the discrete energy level. Thus, the sizeof the energy gap is changed. In addition, the charges are confinedwithin the quantum dot, so that the light emitting efficiency can beimproved.

Different from general fluorescent pigments, the fluorescent wavelengthof the quantum dot may vary depending on the size of the particles. Indetail, the light has the shorter wavelength as the size of the particlebecomes small, so the fluorescent light having the wavelength band ofvisible ray can be generated by adjusting the size of the particles. Inaddition, the quantum dot represents the extinction coefficient higherthan that of the general fluorescent pigment by 100 to 1000 times andhas the superior quantum yield, so that strong fluorescent light can begenerated.

The quantum dots can be synthesized through the chemical wet scheme.According to the chemical wet scheme, the particles are grown byimmersing the precursor material in the organic solvent. The quantumdots can be synthesized through the chemical wet scheme.

The matrix 440 surrounds the wavelength conversion particles 430. Indetail, the wavelength conversion particles 430 are uniformlydistributed in the matrix 440. The matrix 440 includes polymer. Thematrix 440 is transparent. That is, the matrix 440 includes transparentpolymer.

The matrix 440 is disposed in the tube 410. In detail, the matrix 440 isfully filled in the tube 410. The matrix 440 may adhere to an innersurface of the tube 410.

An air layer 450 is formed between the sealing member 420 and the matrix440. The air layer 450 is filled with nitrogen. The air layer 450performs the damping function between the sealing member 420 and thematrix 440.

The wavelength conversion member 400 can be prepared through thefollowing method.

First, the wavelength conversion particles 430 are uniformly distributedin a resin composition. The resin composition is transparent. The resincomposition may have photo-curable property.

Then, internal pressure of the tube 410 is reduced, an inlet of the tube410 is immersed in the resin composition in which the wavelengthconversion particles 430 are distributed, and ambient pressure isincreased. Thus, the resin composition having the wavelength conversionparticles 430 is introduced into the tube 410.

Then, a part of the resin composition introduced into the tube 410 isremoved and the inlet of the tube 410 becomes empty.

After that, the resin composition introduced into the tube 410 is curedby UV light so that the matrix 440 can be formed.

Then, epoxy resin composition is introduced into the inlet of the tube410. The introduced epoxy resin composition is cured so that the sealingmember 420 is formed. The process for forming the sealing member 420 isperformed under the nitrogen atmosphere, so the air layer 450 includingnitrogen is formed between the sealing member 420 and the matrix 440.

The optical sheets 500 are disposed on the light guide plate 200 toimprove the characteristic of the light passing through the opticalsheets 500.

The FPCB 600 is electrically connected to the light emitting diodes 300.The FPCB 600 can mount the light emitting diodes 300 thereon. The FPCB600 is installed in the mold frame 10 and arranged on the light guideplate 200.

The FPCB 600 can be bonded to the light guide plate 200. That is, adual-side tape 610 is interposed between the FPCB 600 and the lightguide plate 200 to bond the FPCB 600 to the light guide plate 200.

The mold frame 10 and the backlight assembly 20 constitute the backlightunit. That is, the backlight unit includes the mold frame 10 and thebacklight assembly 20.

The liquid crystal panel 30 is installed in the mold frame 10 andarranged on the optical sheets 500.

The liquid crystal panel 30 displays images by adjusting intensity ofthe light passing through the liquid crystal panel 30. That is, theliquid crystal panel 30 is a display panel to display the images. Theliquid crystal panel 30 includes a TFT substrate, a color filtersubstrate, a liquid crystal layer interposed between the above twosubstrates and polarizing filters.

As shown in FIGS. 5 and 6, the light emitting diodes 300 and thewavelength conversion member 400 are inserted into the insertion hole201. In addition, the FPCB 600 is attached to a top surface of the lightguide plate 200.

The light emitting diodes 300 and the wavelength conversion member 400are press-fitted into the insertion hole 201. That is, after a gapbetween the rear support section 220 and the light guide section 210 hasbeen slightly widened, the light emitting diodes 300 and the wavelengthconversion member 400 are inserted into the gap and then the gap betweenthe rear support section 220 and the light guide section 210 is narrowedagain.

Therefore, the rear support section 220 and the light guide section arecan securely fix the light emitting diodes 300 and the wavelengthconversion member 400.

In addition, according to the LCD of the embodiment, the light emittingdiodes 300 and the wavelength conversion member 400 can be fixed to thelight guide plate 200 without performing the additional bonding process.Thus, the LCD according to the embodiment can be readily manufactured.

Further, since the light emitting diodes 300 are inserted into theinsertion hole 201 and securely fixed to the light guide plate 200, thelight emitting diodes 300 can be prevented from being separated from thelight guide plate 200. Thus, the light emitted from the light emittingdiodes 300 can be effectively incident into the wavelength conversionmember 400 and the light converted by the wavelength conversion member400 can be effectively incident into the light guide plate 200. Inaddition, the direction of the light emitted from the light emittingdiodes 300 may not deviate from the light guide plate 200.

Therefore, the LCD according to the embodiment may have the improvedreliability.

FIG. 7 is a sectional view showing an LCD according to the secondembodiment, FIG. 8 is a perspective view of a wavelength conversionmember according to the second embodiment, and FIG. 9 is a sectionalview of a LCD according to the second embodiment. In the followingdescription, an adhering member will be additionally described. Inaddition, the description about the previous embodiment will bebasically incorporated herein by reference.

Referring to FIGS. 6 and 7, the adhering member 460 is disposed at anouter surface of the wavelength conversion member 400. The adheringmember 460 is uniformly coated on the entire outer surface of thewavelength conversion member 400. That is, the adhering member 460surrounds the wavelength conversion member 400.

The wavelength conversion member 400 includes a first surface 401, asecond surface 402, a top surface 403 and a bottom surface 404.

The first surface 401 faces the light emitting diodes 300, and thesecond surface 402 faces the light guide plate. In addition, the topsurface 403 extends from an outer peripheral portion of the firstsurface 401 to an outer peripheral portion of the second surface 402,and the bottom surface 404 faces the top surface 403. The adheringmember 460 is disposed on the first surface 401, the second surface 402,the top surface 403 and the bottom surface 404.

The adhering member 460 can be disposed on the top surface 403 and thebottom surface 404 of the wavelength conversion member 400. That is, theadhering member 460 can be disposed between the wavelength conversionmember 400 and the FPCB 600. In addition, the adhering member 460 can bedisposed between the wavelength conversion member 400 and the lightguide section 210. Further, the adhering member 460 can be disposedbetween the wavelength conversion member 400 and the light emittingdiodes 300.

The adhering member 460 is transparent. The adhering member 460 mayadhere to the outer surface of the wavelength conversion member 400. Inaddition, the adhering member 460 may adhere to the light emittingdiodes 300 and the light guide plate 200. In detail, the adhering member460 may adhere to the exit surface of the light emitting diodes 300 andthe incident surface 211 of the light guide plate 200.

Therefore, the air layer is not formed between the light emitting diodes300 and the wavelength conversion member 400 due to the adhering member460. In addition, the air layer is not formed between the wavelengthconversion member 400 and the light guide plate 200 due to the adheringmember 460.

The adhering member 460 performs the optical damping function betweenthe wavelength conversion member 400 and the light guide plate 200. Thatis, the adhering member 460 prevents the air layer from being formedbetween the wavelength conversion member 400 and the exit surface of thelight emitting diodes 300 and between the wavelength conversion member400 and the incident surface 211 of the light guide section 210. Inaddition, the adhering member 460 may have the refractive index similarto that of the tube of the wavelength conversion member 400, the fillerof the light emitting diodes 300 and the light guide plate 200. Thus,the adhering member 460 may diminish the variation of the refractiveindex between the wavelength conversion member 400 and the exit surfaceof the light emitting diodes 300 and between the wavelength conversionmember 400 and the light guide plate 200.

Due to the adhering member 460, the light emitted from the lightemitting diodes 300 and the light converted by the wavelength conversionmember 400 can be effectively incident into the light guide plate 200.

Thus, the LCD according to the embodiment may have the improvedbrightness.

In addition, the adhering member 460 has elasticity. Since the adheringmember 460 has the elasticity, the adhering member 460 may perform themechanical damping function between the wavelength conversion member 400and the light guide plate 200 and between the wavelength conversionmember 400 and the light emitting diodes 300.

Especially, after the adhering member 460 has been coated on the outersurface of the wavelength conversion member 400, the light emittingdiodes 300 and the wavelength conversion member 400 are press-fittedinto the insertion hole 201 of the light guide plate 200. At this time,since the adhering member 460 has the elasticity, the wavelengthconversion member 400 can be effectively protected by the adheringmember 460 when the wavelength conversion member 400 is inserted intothe insertion hole 201.

In particular, if the tube of the wavelength conversion member 400 ismade from glass, the adhering member 460 can prevent the tube from beingbroken.

Thus, the LCD according to the embodiment can be readily assembled andmay have the improved mechanical strength.

FIGS. 10 and 11 are sectional views showing the manufacturing processfor an LCD according to the third embodiment. In the followingdescription, a filling member will be additionally described. Inaddition, the description about the previous embodiments will bebasically incorporated herein by reference.

Referring to FIG. 10, the light emitting diodes 300 and the wavelengthconversion member 400 are inserted into the insertion hole 201 of thelight guide plate 200. At this time, a predetermined space may remainbetween the light emitting diodes 300 and the wavelength conversionmember 400 and between the wavelength conversion member 400 and thelight guide section 210. That is, the light emitting diodes 300 and thewavelength conversion member 400 may not be press-fitted into theinsertion hole 201.

Then, curable resin, that is, a photo curable resin composition and/or athermosetting resin composition 471 is injected into the space betweenthe wavelength conversion member 400 and the light guide section 210.The resin composition 471 may include epoxy resin.

Referring to FIG. 11, UV light and/or heat is applied to the resincomposition 471 injected into the insertion hole 201, so the resincomposition 471 is cured, thereby forming the filling member 470 in theinsertion hole 201.

The filling member 470 performs the optical function substantiallyidentical to that of the adhering member 460.

According to the LCD of the present embodiment, the mechanical damage ofthe wavelength conversion member 400 can be reduced, the brightness canbe improved and the mechanical characteristic can be enhanced.

FIG. 12 is a perspective view showing a light source, a light guideplate and a wavelength conversion member according to the fourthembodiment, and FIG. 13 is a sectional view showing the light source,the light guide plate and the wavelength conversion member according tothe fourth embodiment. The description about the previous embodimentswill be basically incorporated herein by reference.

Referring to FIGS. 12 and 13, the wavelength conversion member 400 isinserted into an insertion hole 202 formed in the light guide plate 200.At this time, the light emitting diodes 300 are disposed at the lateralside of the light guide plate 200. That is, the light emitting diodes300 are disposed at the lateral side of the rear support section 220.

In detail, the rear support section 220 is sandwiched between thewavelength conversion member 400 and the light emitting diodes 300.

The insertion hole 202 may have a width corresponding to a thickness ofthe wavelength conversion member 400. In detail, the width of theinsertion hole 202 is substantially equal to the thickness of thewavelength conversion member 400.

The light emitted from the light emitting diodes 300 is incident intothe wavelength conversion member 400 through the rear support section220. In detail, the light emitted from the light emitting diodes 300 isincident into the wavelength conversion member 400 after the light hasbeen diffused through the rear support section 220.

Thus, the light emitted from the light emitting diodes 300 may not beconcentrated on a local part of the wavelength conversion member 400.Since the light is not concentrated on the local part of the wavelengthconversion member 400, the local degradation of the wavelengthconversion particles included in the wavelength conversion member 400can be prevented.

In addition, the light emitting diodes 300 is spaced apart from thewavelength conversion member 400 by the rear support section 220. Thus,the degradation of the wavelength conversion particles caused by heatgenerated from the light emitting diodes 300 can be prevented.

Further, since the light emitting diodes 300 is assembled with the lightguide plate 200 separately from the wavelength conversion member 400,the LCD according to the embodiment can be readily manufactured.

FIG. 14 is a sectional view showing a light source, a light guide plateand a wavelength conversion member according to the fifth embodiment,and FIG. 15 is a sectional view of an LCD according to the sixthembodiment. The description about the previous embodiments will bebasically incorporated herein by reference.

Referring to FIG. 14, the light guide plate 200 includes the light guidesection 210, the rear support section 220 and a lower support section230. The lower support section 230 is disposed under the wavelengthconversion member 400. That is, the lower support section 230constitutes the bottom of the insertion hole 202 formed in the lightguide plate 200.

The lower support section 230 may support the lower portion of thewavelength conversion member 400. The lower support section 230 maydirectly make contact with the lower portion of the wavelengthconversion member 400. The lower support section 230 extends from thelight guide section 210 to the rear support section 220. The lowersupport section 230, the light guide section 210 and the rear supportsection 220 may be integrally formed. In addition, the light guidesection 210, the rear support section 220 and the lower support section230 may surround the wavelength conversion member 400.

Further, referring to FIG. 15, the lower support section 230 may supportthe lower portion of the light emitting diodes 300. In detail, the lightemitting diodes 300 and the wavelength conversion member 400 aresimultaneously inserted into the insertion hole 201. At this time, thelower support section 230 may simultaneously support the lower portionsof the light emitting diodes 300 and the wavelength conversion member400. That is, the lower support section 230, the light guide section 210and the rear support section 220 may simultaneously surround the lightemitting diodes 300 and the wavelength conversion member 400.

Due to the lower support section 230, the wavelength conversion member400 can be readily fixed in the insertion hole 202. That is, since thelower support section 230 supports the wavelength conversion member 400,the wavelength conversion member 400 can be precisely aligned in theinsertion hole 202. In addition, the light emitting diodes 300 can beprecisely fixed in the insertion hole 202 due to the lower supportsection 230.

FIG. 16 is a perspective view showing a light source, a light guideplate and a wavelength conversion member according to the seventhembodiment, and FIG. 17 is a sectional view showing a light source, alight guide plate and a wavelength conversion member according to theseventh embodiment. The description about the previous embodiments willbe basically incorporated herein by reference.

Referring to FIGS. 16 and 17, the light guide plate 200 includes a firstinsertion hole 202 and a second insertion hole 203. The wavelengthconversion member 400 is aligned in the first insertion hole 202 and thelight emitting diodes 300 are aligned in the second insertion hole 203.

The first and second insertion holes 202 and 203 may extend in onedirection in parallel to each other. In addition, the first and secondinsertion holes 202 and 203 may be parallel to each other.

The light guide plate 200 includes a spacer 240. The spacer 240 isdisposed between the light guide section and the rear support section220. In addition, the spacer 240 is aligned between the first and secondinsertion holes 202 and 203. Thus, the spacer 240 is disposed betweenthe light emitting diodes 300 and the wavelength conversion member 400.That is, the light emitting diodes 300 are spaced apart from thewavelength conversion member 400 by the spacer 240.

Therefore, the spacer 240 can prevent the degradation of the wavelengthconversion particles included in the wavelength conversion member 400.If the light emitting diodes 300 are adjacent to the wavelengthconversion member 400, the wavelength conversion particles included inthe wavelength conversion member 400 may be degraded due to heatgenerated from the light emitting diodes 300. According to theembodiment, the light emitting diodes 300 are spaced apart from thewavelength conversion member 400 by the spacer 240, so the degradationof the wavelength conversion particles included in the wavelengthconversion member 400 can be prevented.

Therefore, the LCD according to the embodiment may have the improvedreliability and the durability.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effects such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

INDUSTRIAL APPLICABILITY

The display device according to the embodiments can be used in thedisplay field.

1. A display device comprising: a light source; a wavelength conversionmember to convert a wavelength of light generated from the light source;and a light guide member to guide the light converted by the wavelengthconversion member, wherein the wavelength conversion member comprises: afirst surface facing the light source; a second surface facing the lightguide member; a top surface extending from the first surface to thesecond surface; and a bottom surface facing the top surface, wherein thewavelength conversion member includes a tube, the tube receives asealing member, an air layer, a matrix therein and a plurality ofquantum dots in the matrix, and wherein the air layer is formed betweenthe sealing member and the matrix.
 2. The display device of claim 1,further comprising a circuit board connected to the light source.
 3. Thedisplay device of claim 1, further comprising an adhering member,wherein the adhering member is disposed on the top surface and thebottom surface.
 4. The display device of claim 3, wherein the adheringmember has elasticity.
 5. The display device of claim 1, wherein thelight guide member comprises: a light guide section into which the lightconverted by the wavelength conversion member is incident; and a rearsupport section connected to the light guide section to support thewavelength conversion member.
 6. The display device of claim 4, whereinthe light guide section is integrally formed with the rear supportsection.
 7. The display device of claim 4, wherein the light guidemember includes a lower support section extending from the light guidesection to the rear support section.
 8. The display device of claim 3,wherein the adhering member has a refractive index between a refractiveindex of the light guide member and a refractive index of the wavelengthconversion member.
 9. A wavelength conversion member comprises: a tube;a sealing member in the tube; an air layer in the tube; a matrix in thetube; and a plurality of quantum dots in the matrix, wherein the airlayer is formed between the sealing member and the matrix.